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Get The better source for precision circuit boards. * ROGERS SERIES * CERAMIC * POLYIMIDE * TEFLON * FLEX * HEAVY COPPER * METAL CORE ALUMINUM OR COPPER *

Shop Capabilities - Delta Precision Circuit Inc.

MATERIAL TYPES:

  • FR4:From Tg of 135'C - 190'C & Td up to 345'C
  • Polyimide
  • Neltek 4000-13
  • Teflon
  • Rogers: RO4000,RO3000 Series
  • Rogers: RT/duroid 5870 & 5880 & RT/duroid 6006 & 6010LM
  • Rogers: TMM - Ceramic Material
  • Aluminum Core - Bergquist, Thermagon, Ventec
  • Flex & Rigid Flex

INNER & OUTERLAYER COPPER WT.:

    • Maximum cu weight: 12 oz
    • Minimum cu weight: 0.5 oz

LAYER CONSTRUCTION

  • Minimum core thickness: .004"
  • Minimum dielectric: .0015"
  • Buried and blind vias
  • Sequential lamination construction

LAMINATION

  • Maximum number of layers: 12
  • Maximum board thickness: .250"
  • Layer-to-Layer Registration +/-.005"
  • Panel Thickness Tolerances
  • .015" - .030" +/- .003"
  • .031" - .080" +/- .005"
  • .081" - .125" +/- .008"
  • .125" +/- 10%

SURFACE FINISHES

  • HASL
  • Lead Free HASL
  • Electrolytic & Electroless Gold over Nickel
  • Electrolytic Wire bondable Gold
  • Electrolytic Soft Gold
  • Immersion Silver
  • Immersion Tin
  • Organic Coating (OSP)

SOLDERMASK / LEGEND

  • Soldermask colors: Red, Green, Blue, Black, Clear
  • Legend colors: White, Yellow, Black, Red, Orange
  • Conductive & non-conductive filled vias
  • Via plug & via cap: Hysol SR1000
  • LED White Solder Mask - (Non-yellowing after Assembly Process)

FABRICATION

  • V-Scoring, Jump V-Scoring
  • Contact Finger Edge Beveling
  • Countersinking, Counter-boring, Controlled Depth Milling

ELECTRICAL TEST

  • CAD net-list testing D356A
  • Flying Probe testing down to .004"

CERTIFICATIONS

  • Minority Owned Corporation
  • UL Certified
  • ISO-9001:2008 Certified
  • IPC-A-600 Class I, II & III trained personnel
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