MATERIAL TYPES:
- FR4:From Tg of 135'C - 190'C & Td up to 345'C
- Polyimide
- Neltek 4000-13
- Teflon
- Rogers: RO4000,RO3000 Series
- Rogers: RT/duroid 5870 & 5880 & RT/duroid 6006 & 6010LM
- Rogers: TMM - Ceramic Material
- Aluminum Core - Bergquist, Thermagon, Ventec
- Flex & Rigid Flex
INNER & OUTERLAYER COPPER WT.:
- Maximum cu weight: 12 oz
- Minimum cu weight: 0.5 oz
LAYER CONSTRUCTION
- Minimum core thickness: .004"
- Minimum dielectric: .0015"
- Buried and blind vias
- Sequential lamination construction
LAMINATION
- Maximum number of layers: 12
- Maximum board thickness: .250"
- Layer-to-Layer Registration +/-.005"
- Panel Thickness Tolerances
- .015" - .030" +/- .003"
- .031" - .080" +/- .005"
- .081" - .125" +/- .008"
- .125" +/- 10%
SURFACE FINISHES
- HASL
- Lead Free HASL
- Electrolytic & Electroless Gold over Nickel
- Electrolytic Wire bondable Gold
- Electrolytic Soft Gold
- Immersion Silver
- Immersion Tin
- Organic Coating (OSP)
SOLDERMASK / LEGEND
- Soldermask colors: Red, Green, Blue, Black, Clear
- Legend colors: White, Yellow, Black, Red, Orange
- Conductive & non-conductive filled vias
- Via plug & via cap: Hysol SR1000
- LED White Solder Mask - (Non-yellowing after Assembly Process)
FABRICATION
- V-Scoring, Jump V-Scoring
- Contact Finger Edge Beveling
- Countersinking, Counter-boring, Controlled Depth Milling
ELECTRICAL TEST
- CAD net-list testing D356A
- Flying Probe testing down to .004"
CERTIFICATIONS
- Minority Owned Corporation
- UL Certified